Semiconductor chip with a metal heat radiator

Details Semiconductor chip with a metal heat radiator Semiconductor chip with a metal heat radiator

1983-03-30

1986-02-18

Sikes, William L.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361388, H01L 500, H01L 300

Patent

active

045716110

ABSTRACT:
A semiconductor chip, including a semiconductor substrate and a radiator plate. An active region is formed on one main surface of the semiconductor substrate. The radiator plate is bonded to the other main surface side of the semiconductor substrate. A recess is formed on the other main surface side so as to dispose the radiator plate therein.

REFERENCES:
patent: 3588632 (1971-06-01), Nakata
patent: 3723833 (1973-03-01), Wheatley, Jr.
patent: 3820153 (1974-06-01), Quinn
patent: 4107727 (1978-08-01), Ikezawa et al.
patent: 4361720 (1982-11-01), Resneau et al.

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