Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-12-26
2006-12-26
Lee, Eddie C. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S730000, C257S678000, C257S688000, C257S776000, C257S618000, C257S622000, C257S620000, C257S098000, C257S433000
Reexamination Certificate
active
07154188
ABSTRACT:
A semiconductor chip includes a semiconductor substrate including first and second surfaces and a plurality of side surfaces, the first and second surfaces being parallel to each other and facing in opposite directions, the side surfaces connecting peripheries of the first and second surfaces. At least one of the side surfaces is an inclined surface with respect to the first and second surfaces, and a groove is formed in the inclined surface. The groove extends in a direction which intersects a plane parallel to the first and second surfaces and extends in a direction which intersects a plane which intersects the first and second surfaces at right angles.
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patent: 5982804 (1999-11-01), Chen et al.
patent: 6711193 (2004-03-01), Yamasaki
patent: 6777767 (2004-08-01), Badehi
patent: 6924513 (2005-08-01), Akaike et al.
patent: B2 3299889 (2002-04-01), None
Im Junghwa
Lee Eddie C.
Oliff & Berridg,e PLC
Seiko Epson Corporation
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