Semiconductor chip removal process and apparatus

Details Semiconductor chip removal process and apparatus Semiconductor chip removal process and apparatus

1993-11-12

1995-06-20

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156 94, 156584, 2940203, 29762, B23P 1904

Patent

active

054258332

ABSTRACT:
The present invention discloses a semiconductor chip removal method of removing a semiconductor chip having thereon a chip electrode from a board having thereon a board electrode wherein the semiconductor chip is bonded to the board with a resin and these chip and board electrodes are connected together electrically by a wire. This semiconductor chip removal method comprises the following steps of: (a) cutting the bonding wire into two pieces by a cutter that presses its cutting edge against the base of the bonding wire on the board electrode's side; (b) separating the semiconductor chip from the board by a chip remover that forces the semiconductor chip sideways, with the adhesive strength of the resin weakened by the application of heat thereto; and (c) removing the semiconductor chip together with a piece of the bonding wire left on the chip electrode's side.

REFERENCES:
patent: 4991286 (1991-02-01), Russo et al.
patent: 5164037 (1991-05-01), Iwami et al.
patent: 5216803 (1993-06-01), Nolan et al.
patent: 5263620 (1993-11-01), Hernandez et al.
Research Disclosure 20 Sep. 1990, Emsworth, GB p. 831, Anonymous "Rework of Chips on Flexible Circuit Boards" abstr. #31, 8047.

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