Semiconductor chip production and testing processes

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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324158D, 324158T, 357 55, 437 8, G01R 3100

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active

049671464

ABSTRACT:
Precisely controlled grooves are formed in a semiconductor wafer as part of a total photolithographic process of producing the circuitry and the V-grooves for precise registration of the circuitry relative the edges of the individual chips of the wafer. The same registration facilitates automated electrical testing of each of the chip circuits on the wafer prior to the controlled disassembly of the array of chips into individual die. The design of the electrical connections on the array before disassociation into individual die also facilitates a mass burn-in of the circuits which burn-in tends to identify and eliminate parts subject to early failure.

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