Semiconductor chip pickup device and pickup method

Details Semiconductor chip pickup device and pickup method Semiconductor chip pickup device and pickup method

2001-12-11

2004-03-23

Osele, Mark A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S583200, C438S464000, C438S976000, C029S426600

Reexamination Certificate

active

06709543

ABSTRACT:

CROSS-REFERENCE TO RELATED APPLICATIONS
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-376319, filed Dec. 11, 2000, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a semiconductor chip pickup jig, a semiconductor chip pickup device and pickup method, and a semiconductor device manufacturing method and apparatus to which the above device and method are applied. More specifically, this invention is generally applied to an apparatus and method which picks up (separates) a plurality of semiconductor chips having a thickness of 100 &mgr;m or less from an adhesive sheet after the semiconductor chips are adhered to the adhesive sheet.
2. Description of the Related Art
Generally, a semiconductor wafer on which elements have been formed is individually separated and divided along dicing lines or chip division lines to form a plurality of semiconductor chips (dies or pellets). The semiconductor chips are adhered to an adhesive sheet (adhesive tape), each of the semiconductor chips is picked up from the adhesive sheet and the thus picked-up semiconductor chip is subjected to a mounting process for mounting the same on a lead frame or TAB tape, a mounting process for sealing the same into a package and the like so as to complete a semiconductor device.
FIG. 1
is a cross sectional view of an enlarged main constituting portion of the conventional pickup device which picks up semiconductor chips from an adhesive sheet. Further,
FIGS. 2A and 2B
are a side view and top view showing a semiconductor chip pickup jig (pin holder and thrust pins) used in the pickup device. When a semiconductor chip
100
is separated and picked up from an adhesive sheet
101
, thrust pins (pickup needles)
102
are moved upwardly (raised) to press the rear surface of the semiconductor chip, push up the semiconductor chip
100
with the adhesive sheet
101
disposed therebetween and separate the semiconductor chip
100
from the adhesive sheet
101
. The thrust pins
102
are arranged in positions corresponding to the corner portions of the semiconductor chip
100
or in positions corresponding to a portion near the central portion thereof and the base portions thereof are mounted on the pin holder
103
.
According to a general order of the steps of separating the semiconductor chip
100
, first, a fixing table on which the adhesive sheet
101
having the semiconductor chips
100
adhered thereto is fixed is moved so as to place one of the semiconductor chips
100
to be picked up above the thrust pins
102
. Next, a mark detection process which is effected to detect the position of the semiconductor chip
100
to be separated and determine a good product or defective product of the semiconductor chip
100
is performed and the internal portion of a backup holder
104
is evacuated to hold and fix the adhesive sheet
101
by suction on the upper surface of the backup holder
104
. In this state, the pin holder
103
on which the thrust pins
102
are attached is raised to project the thrust pins
102
from the upper surface of the backup holder
104
so as to press the rear surface of the semiconductor chip and push up the semiconductor chip
100
with the adhesive sheet
101
disposed therebetween. At this time, the front end portions of the thrust pins
102
mounted on the pin holder
103
are adjusted so as to be set at the same height.
In recent years, it is strongly required to make thin a semiconductor chip in order to contain the semiconductor chip into a card-form thin package, for example, and the rear surface of the semiconductor wafer is polished, ground and etched to reduce the thickness thereof to 100 &mgr;m or less. However, if the semiconductor chip is made thin to 100 &mgr;m or less, there occurs a problem that cracks occur when the semiconductor chip is separated from the adhesive sheet.
Next, a problem of the crack occurring when the semiconductor chip is made thin to 100 &mgr;m or less is explained in detail with reference to
FIGS. 3A and 3B
to
FIGS. 6A and 6B
and
FIGS. 7A and 7B
to
FIGS. 10A and 10B
. If the semiconductor chip is made extremely thin as described above, as shown in
FIGS. 3A and 3B
to
FIGS. 6A and 6B
, the thrust pins
102
will penetrate through a semiconductor chip
100
to cause chip cracks therein when the thrust pins
102
are raised to thrust and push up the rear surface of the semiconductor chip
100
with the adhesive sheet
101
disposed therebetween. If the thickness of the semiconductor chip
100
is 100 &mgr;m or more, the above phenomenon will not occur since the strength (in the thickness direction) of the semiconductor chip is high due to the adhesive strength between the semiconductor chip
100
and the adhesive sheet
101
.
Further, as shown in
FIGS. 7A and 7B
to
FIGS. 10A and 10B
, even when outer peripheral portions (particularly, corner portions) of the semiconductor chip
100
are separated as shown in
FIGS. 8A and 8B
or
FIGS. 9A and 9B
, the semiconductor chip
100
is warped into a concave form before it is separated since the speed at which the adhesive sheet
101
is separated is lower than the rising speed of the thrust pins
102
. As a result, as shown in
FIGS. 10A and 10B
, cracks finally occur. If the positions in which the thrust pins
102
are mounted on the pin holder
103
are set to correspond to a portion near the central portion of the semiconductor chip
100
, it becomes difficult to separate the outer peripheral portions thereof from the adhesive sheet
101
, the semiconductor chip
100
is warped into to a convex form and cracks will occur. Further, even if the number of thrust pins
102
is increased, it is difficult to suppress occurrence of cracks. In addition, it is also impossible to avoid occurrence of cracks even if a tape such as a UV tape having low adhesive strength of the adhesive sheet
101
is used.
Thus, if the thickness of the semiconductor chip is reduced, the strength of the semiconductor chip becomes weak and it is impossible to avoid occurrence of cracks if the conventional semiconductor chip pickup device and pickup method are used. The problem becomes more significant as the size of the semiconductor chip becomes larger. Therefore, it is desired to take measures against occurrence of cracks at the time of pickup.
BRIEF SUMMARY OF THE INVENTION
According to an aspect of the present invention, there is provided a semiconductor chip pickup jig which separates semiconductor chips removably affixed to an adhesive sheet from the adhesive sheet comprising a first group of thrust pins which are arranged in positions corresponding to corner portions of one of the semiconductor chips and thrust up the semiconductor chip by use of first front end portions thereof with the adhesive sheet disposed therebetween; a second group of thrust pins which are arranged in positions corresponding to a nearby portion of a central portion of the semiconductor chip with second front end portions thereof being set lower than the first front end portions of the first thrust pin group and thrust up the semiconductor chip by use of the second front end portions thereof with the adhesive sheet disposed therebetween; and a pin holder on which base portions of the first and second thrust pin groups are mounted.
According to another aspect of the present invention, there is provided a semiconductor chip pickup jig which separates semiconductor chips removably affixed to an adhesive sheet from the adhesive sheet comprising a first group of thrust pins which are arranged in positions corresponding to corner portions of one of the semiconductor chips and thrust up the semiconductor chip by use of first front end portions thereof with the adhesive sheet disposed therebetween; a second group of thrust pins which are arranged in positions corresponding to a nearby portion of a central portion of the semiconductor chip with second front end portions thereof being set at substa

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