Semiconductor chip passivation structures and methods of...

Details Semiconductor chip passivation structures and methods of... Semiconductor chip passivation structures and methods of...

2011-07-05

2011-07-05

Mandala, Victor (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S750000, C257SE23023, C257SE21511, C438S106000, C438S118000

Reexamination Certificate

active

07973408

ABSTRACT:
Various semiconductor chip passivation structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes applying a polymeric passivation layer to a side of a semiconductor chip. The side of the semiconductor chip includes plural conductor pads. Plural openings are formed in the polymeric passivation layer to expose the plural conductor pads. Plural conductor structures are formed on the plural conductor pads.

REFERENCES:
patent: 3615913 (1971-10-01), Shaw
patent: 2004/0056351 (2004-03-01), Wu et al.
patent: 2009/0032941 (2009-02-01), McLellan et al.
Guotao Wang et. al.;Chip packaging interaction: a critical concern for Cu/low k packaging; www.sciencedirect.com; Microelectronics Reliability 45 (2005) 1079-1093.
Marie-Claude Paquet et al.;Underfill Selection Strategy for Pb-Free, Low-K and Fine Pitch Organic Flip Chip Applications; 2006 Electronic Components and Technology Conference; 1-4244-0152-6/06/$20.00 © 2006 IEEE; pp. 1595-1603.
John Baliga;Yet Another Way to Use BCB; Semiconductor International; http://www.semiconductor.net/article/CA6347341.html; Jul. 1, 2006; pp. 1-3.
Stanley Wolf and Richard N. Tauber;Silicon Processing for the VLSI Era, vol. 2—Process Integration; pp. 273-276 and 337; 1990.

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