Semiconductor chip packaging method which heat cures an encapsul

Details Semiconductor chip packaging method which heat cures an encapsul Semiconductor chip packaging method which heat cures an encapsul

1993-10-29

1995-10-10

Paschall, Mark H.

Electric heating

Metal heating

By arc

21912166, 2191216, 437173, 437224, 437219, B23K 2600

Patent

active

054572991

ABSTRACT:
A method for encapsulating a semiconductor chip. The method includes the steps of first positioning a chip over a laser-curing cavity, and then dispensing a predetermined amount of encapsulant over the chip. Sequential steps include synchronizing a firing of a laser pulse immediately after the dispensing step, and curing the encapsulant by conducting heat generated by the laser pulse, through the chip.

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patent: 5219786 (1993-06-01), Noguchi

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