Semiconductor chip packages and assemblies with chip carrier...

Details Semiconductor chip packages and assemblies with chip carrier... Semiconductor chip packages and assemblies with chip carrier...

2006-08-11

2010-06-08

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S685000, C257S686000, C257S701000, C257S735000, C257S737000, C257SE23030, C257SE23060, C257SE25006, C257SE25013, C257SE25021, C257SE25027

Reexamination Certificate

active

07732912

ABSTRACT:
A microelectronic element package has one or more individual carrier units overlying a region or regions of the front or rear surface of the microelectronic element, leaving other regions of the microelectronic element surface uncovered. The carrier units can be made economically using only a small area of a dielectric film or other circuit panel material.

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patent: 2005/0181544 (2005-08-01), Haba et al.
patent: 2005/0181655 (2005-08-01), Haba et al.

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