Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1992-10-07
1996-04-30
Monin, Jr., Donald L.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257786, 257778, 257783, H01L 2348, H01L 2302
Patent
active
055127835
ABSTRACT:
A semiconductor chip package comprising at least one semiconductor chip disposed in a package and a plurality of first and second pins extending from the package, which first pins are electrically connected to the at least one semiconductor chip and are adapted to conduct signals between the at least one semiconductor chip and external circuitry, the first pins being divided into a plurality of groups, each group representing a respective signal type, and which second pins are not electrically connected to the at least one semiconductor chip, the first pins of at least one group and the second pins being asymmetrically disposed along edges of the package and the remaining groups of first pins being symmetrically disposed along edges of the package. The invention also provides a stacked module of the semiconductor chip packages.
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patent: 4907128 (1990-03-01), Soloman et al.
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patent: 4956694 (1990-09-01), Eide
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patent: 4979016 (1990-12-01), Lee
patent: 5016138 (1991-05-01), Woodman
Wakefield Elwyn P. M.
Walker Christopher P. H.
Inmos Limited
Monin, Jr. Donald L.
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