Semiconductor chip package with a package substrate and a...

Details Semiconductor chip package with a package substrate and a... Semiconductor chip package with a package substrate and a...

2002-12-16

2008-07-15

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S692000, C257S778000, C257S784000

Reexamination Certificate

active

07400036

ABSTRACT:
A semiconductor chip package includes a package substrate having a first bond pad pattern. A semiconductor chip resides on the package substrate. The semiconductor chip has a second bond pad pattern. A lid cover houses the semiconductor chip and is fitted onto the package substrate. The second bond pattern of the semiconductor chip is connected to the first bond pattern of the package substrate through internal conductor traces of the lid cover.

REFERENCES:
patent: 5608262 (1997-03-01), Degani et al.
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6166435 (2000-12-01), Leu et al.
patent: 6294839 (2001-09-01), Mess et al.

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