Semiconductor chip package, semiconductor chip assembly, and...

Details Semiconductor chip package, semiconductor chip assembly, and... Semiconductor chip package, semiconductor chip assembly, and...

2007-10-09

2010-11-16

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S685000, C257S686000, C257SE25018, C438S108000

Reexamination Certificate

active

07834464

ABSTRACT:
A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.

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patent: 1064780 (2001-04-01), None

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