Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-08-30
2011-08-30
Thai, Luan C (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S121000, C438S123000, C257S670000, C257S675000, C257S707000, C257SE23104
Reexamination Certificate
active
08008131
ABSTRACT:
The invention provides semiconductor chip packages, tools, and methods for preventing and for correcting leadfinger deformation caused during wirebonding in semiconductor chip package manufacturing. Disclosed are improved heat blocks and methods for their use in ensuring adequate clearance between leadfingers and adjacent heat spreaders, as well as semiconductor chip package assemblies wherein a selected clearance between leadfingers and parallel surfaces may be assured. Methods of the invention include steps for supporting the proximal ends of the leadfingers using the wirebonding cavity of a heat block. Thus supported, a plurality of bondwires are attached to couple bond pads of the semiconductor chip to the proximal ends of leadfingers. Thereafter, the clearance between the wirebonded proximal ends of the leadfingers and the adjacent parallel surface of the heat spreader is adjusted using a spacing cavity of the heat block. In preferred embodiments of the invention, a plurality of bondwires couple a plurality of bond pads of the semiconductor chip to the proximal end of a single leadfinger, with assured clearance between the proximal end of the leadfinger and an underlying surface.
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Feng Chien-Te
Jin Kevin
Brady III Wade J.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Thai Luan C
Tung Yingsheng
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