Semiconductor chip package and method of forming

Details Semiconductor chip package and method of forming Semiconductor chip package and method of forming

1994-06-30

1995-11-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361765, 361767, 174 522, 174260, 29856, 257698, H05K 118

Patent

active

054672538

ABSTRACT:
A semiconductor device having a substrate support (22) and a method of forming the semiconductor device. A substrate (11) has conductive traces (12) and a bonding pad (13) on a bottom surface and conductive traces (14) and a semiconductor chip attach pad (17) on a top surface. The substrate support (22) has an aperture (23) and is coupled to the substrate (11). A semiconductor chip (31) is coupled to the semiconductor chip attach pad (17). The semiconductor chip (31) is covered by an encapsulating material (38) or a cap (41, 51) which provide protection for the semiconductor chip (31).

REFERENCES:
patent: 5173766 (1992-12-01), Long et al.
patent: 5278726 (1994-01-01), Bernardoni et al.
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5397917 (1995-03-01), Ommen et al.

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