Semiconductor chip package and method for fabricating the same

Details Semiconductor chip package and method for fabricating the same Semiconductor chip package and method for fabricating the same

2008-02-13

2008-11-04

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S110000

Reexamination Certificate

active

07445961

ABSTRACT:
Disclosed are a semiconductor chip package and a method for fabricating the same. The semiconductor chip package includes a semiconductor chip and a circuit board. The semiconductor chip is bonded to the circuit board by means of adhesive except for a metal-exposed region of the semiconductor chip. Anti-migration material is formed between the circuit board and a predetermined portion of the semiconductor chip, in which the predetermined portion of the semiconductor chip has no adhesive, in order to prevent material contained in the metal trace from migrating to the metal-exposed region of the semiconductor chip. A lamination phenomenon is not created between the circuit board and the semiconductor chip after the HAST has been carried out.

REFERENCES:
patent: 4775573 (1988-10-01), Turek
patent: 6429383 (2002-08-01), Sprietsma et al.

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