Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2008-04-08
2008-04-08
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S529000
Reexamination Certificate
active
07355287
ABSTRACT:
Disclosed are a semiconductor chip package and a method for fabricating the same. The semiconductor chip package includes a semiconductor chip and a circuit board. The semiconductor chip is bonded to the circuit board by means of adhesive except for a metal-exposed region of the semiconductor chip. Anti-migration material is formed between the circuit board and a predetermined portion of the semiconductor chip, in which the predetermined portion of the semiconductor chip has no adhesive, in order to prevent material contained in the metal trace from migrating to the metal-exposed region of the semiconductor chip. A lamination phenomenon is not created between the circuit board and the semiconductor chip after the HAST has been carried out.
REFERENCES:
patent: 6002169 (1999-12-01), Chia et al.
patent: 6655022 (2003-12-01), Eskildsen et al.
patent: 6847105 (2005-01-01), Koopmans
patent: 6917119 (2005-07-01), Lee et al.
Hynix / Semiconductor Inc.
Ladas & Parry LLP
Potter Roy
LandOfFree
Semiconductor chip package and method for fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor chip package and method for fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip package and method for fabricating the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2763655