Semiconductor chip package and application device thereof

Details Semiconductor chip package and application device thereof Semiconductor chip package and application device thereof

2005-11-01

2008-09-02

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S098000, C257S099000

Reexamination Certificate

active

07420268

ABSTRACT:
A semiconductor chip package has a pillar body including at least three conductors insulated from each other by an insulating layer. The pillar body has a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer. A plurality of semiconductor chips are attached on the mounting faces and selectively and electrically connected to the conductors. The semiconductor package of the present invention can be used in a semiconductor illuminator which has a housing having a reflecting cup, with the pillar body positioned inside the reflecting cup.

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patent: 2007/0001282 (2007-01-01), Kang et al.

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