Semiconductor chip package

Details Semiconductor chip package Semiconductor chip package

2001-10-31

2002-12-10

Shooman, Ted (Department: 2912)

Equipment for production, distribution, or transformation of ene

Distribution, modification or control

Semiconductor, transistor or integrated circuit

Design Patent

active

D0466873

CLAIM:
The ornamental design for a semiconductor chip package, as shown and described.

REFERENCES:
patent: D345731 (1994-04-01), Owens et al.
patent: 5434357 (1995-07-01), Belcher et al.
patent: 5596231 (1997-01-01), Combs
patent: 5635670 (1997-06-01), Kubota et al.
patent: D396847 (1998-08-01), Nakayama et al.
patent: 5798570 (1998-08-01), Watanabe et al.
patent: 5844307 (1998-12-01), Suzuki et al.
patent: 5959846 (1999-09-01), Noguchi et al.
patent: 6040625 (2000-03-01), Ip
patent: D444132 (2001-06-01), Iwanishi et al.

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