Semiconductor chip package

Details Semiconductor chip package Semiconductor chip package

1997-05-29

1998-12-15

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438612, 438613, 257666, 257673, 257676, 257737, 257738, 2918021, 2918022, H01L 2144, H01L 2148, H01L 2150

Patent

active

058496084

ABSTRACT:
A semiconductor chip package is produced using a lead frame which has an island where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively. After an insulating film is formed on the island, the semiconductor chip is fixed to one side of the island through an adhesive layer while aligning the electrodes of the semiconductor chip with the through holes of the island portion, respectively. After sealing the semiconductor chip with sealing resin, solder balls are formed on the other side of the island portion, the solder balls are connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.

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