Special receptacle or package – For a vehicle
Patent
1974-07-01
1976-03-30
Price, William
Special receptacle or package
For a vehicle
206445, 206515, 220 238, B65D 8530
Patent
active
039468640
ABSTRACT:
The specification discloses a package for a plurality of semiconductor chips which enables both visual and physical inspection and testing of the chips prior to the opening of the package. The package includes first and second transparent plastic sheets each having an array of depressions formed therein. The sheets are adjacently disposed and the depressions are mated and nested with one another in order to form a plurality of discrete compartments for containing the semiconductor chips. The sheets are attached about the peripheries to form a package for transmitting the chips. Apertures are formed through each of the plastic sheets in the region of each of the compartments, the apertures being smaller than the chips to constrain the chips within the compartments while allowing access to the chips through the apertures to enable physical testing of electrical characteristics of the chips. Due to the transparent nature of the plastic sheets, the chips may also be visually inspected prior to opening of the package.
REFERENCES:
patent: 1671285 (1928-05-01), Hanna
patent: 1758568 (1930-05-01), Finley
patent: 2902628 (1959-09-01), Leno
patent: 3103774 (1963-09-01), Wall
patent: 3385426 (1968-05-01), May et al.
patent: 3469686 (1969-09-01), Gutsche et al.
patent: 3650430 (1972-03-01), Siegmar et al.
patent: 3661253 (1972-05-01), Cronkhite
Bernstein Bruce H.
Price William
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