Semiconductor chip mounting system

Details Semiconductor chip mounting system Semiconductor chip mounting system

1984-03-19

1986-03-11

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Electrical device making

228123, 357 71, 357 81, 357 82, 427 89, 428620, H01L 2158

Patent

active

045744700

ABSTRACT:
A semiconductor chip module with a flat mounting surface is disclosed. A wafer-scale silicon semiconductor chip is provided with electronic circuits formed therein. The chip has a metallized back face and contacts on the opposite, front face. A solder layer secures the metallized back face of the chip to the mounting surface substantially without voids.

REFERENCES:
patent: 4176443 (1979-12-01), Iannuzzi et al.
patent: 4454528 (1984-06-01), Trueblood

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