Semiconductor chip-mounting board providing a high bonding stren

Details Semiconductor chip-mounting board providing a high bonding stren Semiconductor chip-mounting board providing a high bonding stren

1997-07-18

2000-05-09

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361783, 257737, 257778, 174260, 174261, 438613, 22818022, H05K 702

Patent

active

060612487

ABSTRACT:
A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby to improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.

REFERENCES:
patent: 3871015 (1975-03-01), Lin et al.
patent: 5186383 (1993-02-01), Melton et al.
patent: 5269453 (1993-12-01), Melton et al.
patent: 5346118 (1994-09-01), Degani et al.
patent: 5381307 (1995-01-01), Hertz et al.

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