Semiconductor device manufacturing: process – Miscellaneous
Reexamination Certificate
2006-09-19
2006-09-19
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Miscellaneous
Reexamination Certificate
active
07109133
ABSTRACT:
Semiconductor chip mounting apparatus90is provided with semiconductor chip supply unit10, semiconductor chip carrier unit20, lead frame carrier unit30, sensor unit60and a control unit70. Semiconductor chip carrier unit20picks up a semiconductor chip3from semiconductor chip supply unit10and carries the same to mounting position50of lead frame31and mounts it on mounting position50. Sensor unit60measures first and second positions of semiconductor chip carrier unit20before and during mounting operations, respectively. Control unit70compares the first position of semiconductor chip carrier unit20with the second one of semiconductor chip carrier unit20and calculates position deviations. Control unit70further provides position adjustment instructions when the position deviations are greater than a predetermined value thereby to improve the throughput and precision of semiconductor chip mounting apparatus90.
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Murata Noriyuki
Yoshimura Seiichi
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