Semiconductor chip-making without scribing

Details Semiconductor chip-making without scribing Semiconductor chip-making without scribing

1997-10-16

1999-03-16

Breneman, R. Bruce

Semiconductor device manufacturing: process

Semiconductor substrate dicing

438462, H01L 21301

Patent

active

058829881

ABSTRACT:
A method for fracturing semiconductor crystal wafers or bars to form individual chips with active devices without the use of mechanical scribing of the crystal. The method involves forming where fracture is desired a shallow trench by etching in the semiconductor wafer or bar, preferably with sharp corners, or providing over where the fracture is desired the edges of a metallization layer, or both. Applying pressure will then cause the crystal to fracture as a result of strains formed in the crystal at the sharp corners or below the metallization edges. The method is particularly suitable for the fabrication of laser chips from compound semiconductors.

REFERENCES:
patent: 3897627 (1975-08-01), Klatskin
patent: 4096619 (1978-06-01), Cook, Jr.
patent: 4236296 (1980-12-01), Woolhouse et al.
patent: 4237601 (1980-12-01), Woolhouse et al.
patent: 4610079 (1986-09-01), Abe et al.
patent: 4758532 (1988-07-01), Yagi et al.
patent: 4804641 (1989-02-01), Arlt et al.
patent: 4904617 (1990-02-01), Muschke
patent: 4929300 (1990-05-01), Wegleiter
patent: 5017512 (1991-05-01), Takagi
patent: 5024970 (1991-06-01), Mori
patent: 5196378 (1993-03-01), Bean et al.
patent: 5198069 (1993-03-01), Zimmermann et al.
patent: 5206181 (1993-04-01), Gross
patent: 5212394 (1993-05-01), Iwasaki et al.
patent: 5259925 (1993-11-01), Herrick et al.
patent: 5284792 (1994-02-01), Forster et al.
patent: 5363395 (1994-11-01), Gaines et al.
patent: 5393706 (1995-02-01), Mignardi et al.
patent: 5399885 (1995-03-01), Thijs et al.
patent: 5418190 (1995-05-01), Cholewa et al.

Affiliated with

Also associated with

Rating

Semiconductor chip-making without scribing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip-making without scribing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip-making without scribing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-817218