Semiconductor chip interface

Details Semiconductor chip interface Semiconductor chip interface

1984-04-27

1987-05-19

James, Andrew J.

357 82, 357 80, 357 74, H01L 2348, H01L 2352, H01L 2340, H01L 2312

Patent

active

046672192

ABSTRACT:
A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts of the semiconductor chip. A plurality of transmission elements are located proximate the connector plate opposite from the semiconductor chip. A plurality of flexible conductors extend through the respective apertures of the connector plate. The flexible conductors are electrically coupled to the contacts of the chip and to the transmission elements.

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