Semiconductor chip housing

Details Semiconductor chip housing Semiconductor chip housing

1985-09-26

1987-10-20

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 68, H01L 2302

Patent

active

047015730

ABSTRACT:
A semiconductor chip housing provides hermetic sealing and appropriate electrical characteristics for use at high frequencies. The housing comprises a substrate in which the chip is mounted and a cylindrical tube having a top cover and extending above the substrate which impinges on a base and thus hermetically seals the chip. Microthin leads extend from the substrate periphery to the chip. The leads carrying high frequency signals have notches therein to compensate for the impedance introduced by the tube and to enable the microstrip to present a constant impedance at high frequencies throughout its length.

REFERENCES:
patent: 3622419 (1971-11-01), London et al.
patent: 3671813 (1972-06-01), Wilcox
patent: 3683241 (1972-08-01), Duncan
patent: 3715635 (1973-02-01), Michel et al.
patent: 3946428 (1976-03-01), Anazawa et al.
patent: 4400870 (1983-08-01), Islam

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