Semiconductor chip having dummy pattern

Details Semiconductor chip having dummy pattern Semiconductor chip having dummy pattern

1993-06-22

1995-07-04

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

257620, 257797, 437226, 437227, H01L 2178

Patent

active

054303257

ABSTRACT:
A plurality of semiconductor chips are formed on a wafer. By forming a dummy pattern of a linear shape on an insulating film formed on a semiconductor chip along dicing lines provided for separating the plurality of semiconductor chips into the individual semiconductor chips, when the separation of the semiconductor chips is performed along the dicing lines, an advancing of a film peeling to a recognition mark for bonding within the dummy pattern or elements is prevented to reduce both a recognition error of information at the time of bonding of the semiconductor chip and the number of defective elements.

REFERENCES:
patent: 4364078 (1982-12-01), Smith et al.
patent: 4396934 (1983-08-01), Nishida et al.
patent: 4841354 (1989-06-01), Inaba

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