Semiconductor chip having coolant path, semiconductor...

Details Semiconductor chip having coolant path, semiconductor... Semiconductor chip having coolant path, semiconductor...

2008-05-13

2008-05-13

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000, C257S719000, C257SE23088

Reexamination Certificate

active

11274588

ABSTRACT:
The present invention relates to a semiconductor chip coolant path, a semiconductor package utilizing the semiconductor chip coolant path, and a cooling system for the semiconductor package. For effective dissipation of heat generated during semiconductor chip operation, a semiconductor chip having a coolant path formed through or adjacent to its backside and a semiconductor package utilizing the semiconductor chip are provided. In addition, a cooling system for the semiconductor package circulates a coolant through the coolant path within the semiconductor package to directly contact and cool the semiconductor chip.

REFERENCES:
patent: 6351384 (2002-02-01), Daikoku et al.
patent: 6801429 (2004-10-01), Tsai et al.
patent: 7032392 (2006-04-01), Koeneman et al.
patent: 06-061391 (1994-03-01), None
patent: 10-261748 (1998-09-01), None
English language abstract of Japanese Publication No. 06-061391.
English language abstract of Japanese Publication No. 10-261748.

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