Semiconductor chip having a soldering layer sequence, and...

Details Semiconductor chip having a soldering layer sequence, and... Semiconductor chip having a soldering layer sequence, and...

2006-03-30

2009-10-06

Kebede, Brook (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Plural light emitting devices

C257SE21053

Reexamination Certificate

active

07598529

ABSTRACT:
A semiconductor chip (1), to which a layer sequence (2) intended for the production of a soldered connection has been applied. The layer sequence (2) comprises a solder layer (15) and an oxidation prevention layer (17), which follows the solder layer (15) as seen from the semiconductor chip (1). A barrier layer (16) is included between the solder layer (15) and the oxidation prevention layer (17). This prevents a constituent of the solder layer (15) from diffusing through the oxidation prevention layer (17) prior to the soldering operation, where it would effect oxidation that is disadvantageous for producing a soldered connection.

REFERENCES:
patent: 4817854 (1989-04-01), Tihanyi et al.
patent: 5197654 (1993-03-01), Katz et al.
patent: 5877086 (1999-03-01), Aruga
patent: 5990560 (1999-11-01), Coult et al.
patent: 2003/0137058 (2003-07-01), Magerlein et al.
patent: 2004/0256632 (2004-12-01), Stein et al.
patent: 1 614 668 (1970-10-01), None
patent: 103 50 707 (2004-11-01), None
patent: 10329364 (2005-02-01), None
patent: 1 207 010 (1970-09-01), None
I. Schnitzer, et al., “30% external quantum efficiency from surface textured, thin-film light-emitting diodes”, Appl. Phys. Lett. vol. 63, No. 16, pp. 2174-2176, Oct. 18, 1993.

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