Semiconductor chip having a dummy pattern

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

Patent

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Details

428210, 428457, 428458, 438462, 438926, B32B 300, H01L 2100

Patent

active

057630577

ABSTRACT:
A narrow dummy pattern made of aluminum is formed between an identification area of a semiconductor chip and a dicing line to prevent film peeling in a dicing operation from reaching the identification area.

REFERENCES:
patent: 3897627 (1975-08-01), Klatskin
patent: 4073055 (1978-02-01), Kimura
patent: 5017512 (1991-05-01), Takagi
patent: 5206181 (1993-04-01), Gross
patent: 5430325 (1995-07-01), Sawada et al.

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