Semiconductor chip having a dam to prevent contamination of phot

Details Semiconductor chip having a dam to prevent contamination of phot Semiconductor chip having a dam to prevent contamination of phot

1995-04-24

1996-06-25

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

25022723, 257443, 257459, 257667, H01L 310224, H01L 310232

Patent

active

055302785

ABSTRACT:
In dicing of semiconductor chips from a wafer and mounting of the chips in an apparatus, techniques ensure the integrity of bonding pads and wire bonds in the dicing of individual chips and the connection of wire bonds to the chips. The wire bonds in the undiced chips are each connected to a probe pad disposed in an inter-chip area on the wafer, and this probe pad is used to accept probe pins which may otherwise damage the bonding pads on the chips themselves. In the dicing step, the probe pads are obliterated by the cutting blade. A polyimide dam disposes adjacent the bonding pads restricts the migration of liquid encapsulant securing the wire bonds to the bonding pads.

REFERENCES:
patent: 4737208 (1988-04-01), Bloechle et al.
patent: 5026667 (1991-06-01), Roberts, Jr.
patent: 5037779 (1991-08-01), Whalley et al.
patent: 5106784 (1992-04-01), Bednarz
patent: 5176971 (1993-01-01), Shimamura et al.
patent: 5300815 (1994-04-01), Rostoker
patent: 5328870 (1994-07-01), Marrs
patent: 5422163 (1995-06-01), Kamiyama et al.

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