Semiconductor chip flipping assembly and apparatus for...

Details Semiconductor chip flipping assembly and apparatus for... Semiconductor chip flipping assembly and apparatus for...

2007-06-19

2009-10-06

Patel, Paresh (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

Reexamination Certificate

active

07598729

ABSTRACT:
A semiconductor chip flipping assembly and an apparatus for bonding a semiconductor chip using the same are disclosed. In accordance with the semiconductor chip flipping assembly and the apparatus for bonding a semiconductor chip using the same, a front surface of a wafer is mounted in a wafer holder to face downward. Each of dies of the wafer is then pushed downward to a tray disposed therebelow, thereby eliminating a need for a separate flipping process of the semiconductor chip and two or more robot arms.

REFERENCES:
patent: 3793714 (1974-02-01), Bylander
patent: 6311391 (2001-11-01), Fuke et al.
patent: 6872596 (2005-03-01), Waeckerle

Affiliated with

Also associated with

Rating

Semiconductor chip flipping assembly and apparatus for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip flipping assembly and apparatus for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip flipping assembly and apparatus for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4069324