Semiconductor chip connection components with adhesives and meth

Details Semiconductor chip connection components with adhesives and meth Semiconductor chip connection components with adhesives and meth

1993-10-26

1996-08-20

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174254, 174259, 361767, H05K 114

Patent

active

055480918

ABSTRACT:
A semiconductor chip connection component is provided with an adhesive, desirably in a solid, non-tacky condition on its bottom surface. The adhesive may be present in a pattern covering less than all of the component bottom surface, so as to provide a void-free interface when the adhesive bonds the component to the top surface of a chip. The adhesive desirably is brought to a flowable condition by heat transferred from the chip itself. The connection component may include leads having base metal strips in a trace area underlying the top surface and noble metal portions protruding beyond an edge of the top layer. A flowable, curable material encapsulates the base metal sections. Because the base metal sections desirably are free of undercuts, the same can be encapsulated in a void-free manner during formation of the component.

REFERENCES:
patent: 4157932 (1979-06-01), Hirata
patent: 4955132 (1990-09-01), Ozawa et al.
patent: 5072289 (1991-12-01), Sugimoto et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5406459 (1995-04-01), Tsukamoto et al.

Affiliated with

Also associated with

Rating

Semiconductor chip connection components with adhesives and meth does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip connection components with adhesives and meth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip connection components with adhesives and meth will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2331634