Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2005-02-01
2005-02-01
Ngo, Hung V. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C257S777000
Reexamination Certificate
active
06849802
ABSTRACT:
A semiconductor chip has connection lines that are routed to the side surface from bump pads on the back surface of the chip. Such semiconductor chips are stacked on a circuit board to form a chip stack package while bumps are interposed between the bump pads of the lower chip and bonding pads of the upper chip. Further, an interconnecting member such as a conductive adhesive or a wiring board is applied to the side surfaces of the stacked chips such that the connection lines are connected to the interconnecting member. Therefore, the centrally disposed bonding pads of the chips are electrically connected to the circuit board through the bumps, the bump pad, the connection lines and the interconnecting member. The semiconductor chip may have heat dissipation part formed on the back surface. Methods of manufacturing the semiconductor chip and the chip stack package are also provided.
REFERENCES:
patent: 5394303 (1995-02-01), Yamaji
Kang Sa Yoon
Son Min Young
Song Young Hee
Harness & Dickey & Pierce P.L.C.
Ngo Hung V.
Samsung Electronics Co. LTD
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