Semiconductor chip, chip-on-chip structure device, and...

Details Semiconductor chip, chip-on-chip structure device, and... Semiconductor chip, chip-on-chip structure device, and...

2005-03-22

2005-03-22

Pham, Long (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S107000, C438S123000, C438S975000

Reexamination Certificate

active

06869829

ABSTRACT:
A semiconductor chip (3) to be positioned with a front face thereof downward for formation of a chip-on-chip structure has electrode marks (35) provided on a back face (34) thereof. The electrode marks (35) are respectively provided in association with a plurality of electrodes (33) provided on the front face (31) of the semiconductor chip in the same arrangement as the arrangement of the electrodes (33). The arrangement of the electrode marks (35) represents the arrangement of the electrodes (33) on the front face (31) when viewed from the side of the back face (34) of the semiconductor chip3. Therefore, the semiconductor chip (3) can easily be positioned with the front face downward on the basis of the electrode marks (35).

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