Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2005-08-02
2005-08-02
Thai, Luan (Department: 2827)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C438S106000, C438S118000, C438S125000
Reexamination Certificate
active
06924211
ABSTRACT:
A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chips2are intermittently formed on a tape shaped base material11in the longitudinal direction of the base material11to have a substantially identical shape with that of the semiconductor chip2to be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portions12has gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chips2and prevent a wasteful use of an adhesive agent.
REFERENCES:
patent: 5030308 (1991-07-01), Sheyon et al.
patent: 5667073 (1997-09-01), Okui
patent: 6103554 (2000-08-01), Son et al.
patent: 6412641 (2002-07-01), Anderson
patent: 59-66153 (1984-04-01), None
patent: WO 88/03704 (1998-05-01), None
Gbe Kazuyoshi
Yamazaki Osamu
Lintec Corporation
Thai Luan
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