Semiconductor chip carrier system

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

174 524, 357 80, 357 81, 361386, 361398, H04K 114

Patent

active

048736155

ABSTRACT:
An integrated circuit semiconductor chip carrier system (10) which provides reliable interconnection of one or more semiconductor chips (13) to external circuitry in environments of variable temperature and stress. The system (10) includes a housing (11), one or more semiconductor chips (13) mounted on a substrate (12), and a plurality of electrical terminals (36) which extend through one or more walls (21, 22, 23, 24) of the housing (11). Each terminal (36) having an inner resilient portion (36b) which is adapted to be electrically connected to a contact pad (32) which is in electrical engagement with a semiconductor chip (13) on the substrate (12). The inner resilient portions (36b) being directly connected to the pads (32) in such a manner so that as the substrate (12) expands and contracts according to temperature variations, the inner resilient portions (36b) move accordingly, thereby eliminating harmful stresses which results in "bi-metal effect". A non-conductive, flexible, electrical interconnection member (76) is also provided for electrically connecting the semiconductor chips (13) of the substrate (12) to a plurality of terminals (36). The interconnection member (76) is attached to the substrate (12) in only a very few locations enabling the interconnection member (76) to be restrained in lateral movement while permitting the contact pads (78) of the interconnection member (76) to flex and deform freely relative to the substrate (12) and the semiconductor chips (13) as a result of temperature variations.

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