Semiconductor chip carrier package

Details Semiconductor chip carrier package Semiconductor chip carrier package

1988-04-27

1989-08-22

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361414, 165 804, 357 81, H05K 720

Patent

active

048601659

ABSTRACT:
A semiconductor chip carrier package formed of a multi-layer circuit board having mounted therein a semiconductor chip support pad. The multi-layer circuit board is comprised of separate dielectric boards defining multiple conductive run layers including a signal layer and a plurality of power layers. A pluralilty of pins supported from the circuit board extending from one side thereof and including signal pins and power pins. The power pins are disposed peripherally outside of the signal pins. Means are provided for conductively connecting leads of the semiconductor chip to corresponding conductive runs of the signal and power layers.

REFERENCES:
patent: 4245273 (1981-01-01), Feinberg
patent: 4509096 (1985-04-01), Baldwin
patent: 4521828 (1985-06-01), Fanning
patent: 4563725 (1986-01-01), Kirby
patent: 4628407 (1986-12-01), August
patent: 4630172 (1986-12-01), Stenerson
patent: 4652970 (1987-03-01), Watari
patent: 4731701 (1988-03-01), Kuo
patent: 4744008 (1988-05-01), Black
patent: 4765400 (1988-08-01), Chu

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