Semiconductor chip carrier, module having same chip carrier moun

Details Semiconductor chip carrier, module having same chip carrier moun Semiconductor chip carrier, module having same chip carrier moun

1992-06-23

1994-01-25

Paumen, Gary F.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

361777, 361792, 174255, 174261, 257778, H05K 111

Patent

active

052811514

ABSTRACT:
A semiconductor chip carrier, an electronic module having the semiconductor chip carrier mounted therein, and an electronic device incorporating the electronic module. A semiconductor chip carrier comprises a multi-layer wiring substrate including a multi-layer ceramic board, and a thin film circuit mounted on said multi-layer ceramic board, and a semiconductor chip mounted and connected to the thin film circuit, wherein a low-resistance conductor path is provided on the surface of or in the multi-layer wiring substrate to connect between signal terminals which need to be connected with a low-resistance wire in the semiconductor chip, thereby realizing signal transmission at low resistance between the signal terminals of the semiconductor chip by this conductor path. This arrangement makes it possible to shorten the signal delay time of a semiconductor chip, and achieve higher speed signal processing in modules and electronic equipment in which a thus-improved semiconductor chip is used.

REFERENCES:
patent: 4924353 (1990-05-01), Patraw
patent: 4937707 (1990-06-01), McBride et al.
patent: 4967314 (1990-10-01), Higgins, III
patent: 5019945 (1991-05-01), Smolley
patent: 5157589 (1992-10-01), Cole, Jr. et al.
patent: 5165984 (1992-11-01), Schoenthaler
"Hard Ware Technology of the Ultra-Large Processor Group Hitac M-880," Hitachi Hyoron, vol. 73, No. 2, (1991-2), pp. 41-48. (Japanese).

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