Semiconductor chip bonding method

Details Semiconductor chip bonding method Semiconductor chip bonding method

1996-04-12

1998-05-12

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228253, H01L 2158

Patent

active

057495106

ABSTRACT:
A chip mounting section "H", defined on a flush surface of a substrate 1, is dissected into a plurality of subsections "E"--"E". Bond 2 is applied within the chip mounting section "H" on the flush surface of substrate 1 in a discrete manner so that a plurality of bonding bumps 2 are arranged within each region of subsection "E". A minimum clearance "L" between two bonding bumps 2, 2 in the same subsection "E" is smaller than a minimum clearance "D" between two bonding bumps 2, 2 belonging to adjacent to subsections "E" and "E". A chip 3 is mounted on plural bonding bumps 2 by applying a force thereon, thereby mashing plural bonding bumps 2 by a bottom surface of chip 3 without causing any void therein.

REFERENCES:
patent: 5523260 (1996-06-01), Missele
patent: 5620927 (1997-04-01), Lee

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