Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2007-07-17
2007-07-17
Malsawma, Lex (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
Reexamination Certificate
active
10894593
ABSTRACT:
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The pillar extends into an opening in the ground plane, the solder joint contacts and electrically connects the pillar and the ground plane, and the ground plane is electrically connected to the pad.
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U.S. Appl. No. 10/714,794, filed Nov. 17, 2003, entitled “Semiconductor Chip Assembly with Embedded Metal Pillar”.
Bridge Semiconductor Corporation
Malsawma Lex
Sigmond David M.
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