Semiconductor chip assemblies and methods of making same

Details Semiconductor chip assemblies and methods of making same Semiconductor chip assemblies and methods of making same

1992-04-09

1994-09-13

Thomas, Tom

Fishing, trapping, and vermin destroying

437211, 437215, 437217, 437220, H01L 2160

Patent

active

053468619

ABSTRACT:
A semiconductor chip assembly is mounted to contact pads in a compact area array. An interposer is disposed between the chip and the substrate. The contacts on the chip are connected to terminals on the interposer by flexible leads extending through apertures in the interposer. The terminals on the interposer in turn are bonded to the contact pads on the substrate. Flexibility of the leads permits relative movement of the contacts on the chip relative to the terminals and the contact pads of the substrate and hence relieves the stresses caused by differential thermal expansion. The arrangement provides a compact structure similar to that achieved through flip-chip bonding, but with markedly increased resistance to thermal cycling damage.

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