Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-08-02
2005-08-02
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S737000, C257S739000, C257S786000, C257S674000
Reexamination Certificate
active
06924553
ABSTRACT:
An integrated circuit is electrically connected with a plurality of pads. A passivation film covers a part of each of the pads and exposes the other part of each of the pads. Bumps are formed on the pads, respectively. Each of the bumps is a single layer disposed on a part of each of the pads exposed from the passivation film, and on the passivation film.
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Flynn Nathan J.
Mandala Jr. Victor A.
Oliff & Berridg,e PLC
Seiko Epson Corporation
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