Semiconductor chip and semiconductor device, and method of...

Details Semiconductor chip and semiconductor device, and method of... Semiconductor chip and semiconductor device, and method of...

2011-02-22

2011-02-22

Maldonado, Julio J (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C257S618000, C257SE23179, C257SE21499

Reexamination Certificate

active

07892886

ABSTRACT:
At least a part of an outer edge of a surface where a circuit forming region, for example, of a semiconductor substrate that forms a semiconductor chip is arranged (a region surrounded by a scribe line around the circuit forming region) is cut or polished, so as to form a smooth slope is chamfered non-parallel and non-vertical to the circuit forming region. Then, a code indicating management information is assigned to the slope. Further, a plurality of semiconductor chips are stacked to manufacture a semiconductor device.

REFERENCES:
patent: 5644102 (1997-07-01), Rostoker
patent: 6204564 (2001-03-01), Miyata et al.
patent: 2010/0044858 (2010-02-01), Cohn et al.
patent: 2000-228341 (2000-08-01), None

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