Semiconductor chip and semiconductor device

Details Semiconductor chip and semiconductor device Semiconductor chip and semiconductor device

2011-08-09

2011-08-09

Sandvik, Benjamin P (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S773000, C257SE23060, C257SE23129

Reexamination Certificate

active

07994638

ABSTRACT:
In this semiconductor chip3, a table electrode13is interposed between a bump electrode14and an electrode pad6. The table electrode13is formed by forming a plurality of cores15having a smaller Young's modulus than the bump electrode14, on the electrode pad6, and then covering the surfaces of the cores15with a conductive electrode16. When the semiconductor chip3is flip-chip mounted, the bump electrode14is plastically deformed and the table electrode13is elastically deformed appropriately, thereby obtaining a good conductive state.

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patent: 2005-503014 (2005-01-01), None
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