Semiconductor chip and semiconductor device

Details Semiconductor chip and semiconductor device Semiconductor chip and semiconductor device

2011-08-02

2011-08-02

Cox, Cassandra (Department: 2816)

Static information storage and retrieval

Interconnection arrangements

C327S419000

Reexamination Certificate

active

07990747

ABSTRACT:
There are provided a semiconductor device and a semiconductor chip, in which the interconnection is made to be highly reliable by stacking three or more layers of chips without contact therebetween. A semiconductor chip of the present invention comprises a first signal transmission circuit, a silicon substrate on which a first changeover switch is formed, and an interconnection layer on which a first capacitive-coupling upper electrode is formed, wherein a first capacitive-coupling lower electrode is additionally formed on the rear surface of the silicon substrate through a first via hole that penetrates the silicon substrate and, whereas the first capacitive-coupling upper electrode is directly connected to the first signal transmission circuit, the first capacitive-coupling lower electrode is connected to the first signal transmission circuit through the first via hole and through the first changeover switch.

REFERENCES:
patent: 7738312 (2010-06-01), Shimano et al.
patent: 7906846 (2011-03-01), Hoshino et al.
patent: 2009/0065871 (2009-03-01), Lin et al.
patent: 56-002662 (1981-01-01), None
patent: 60-246654 (1985-12-01), None
patent: 62-020362 (1987-01-01), None
patent: 5-190770 (1993-07-01), None
patent: 8-241961 (1996-09-01), None
patent: 9-504908 (1997-05-01), None
patent: 2006019328 (2006-01-01), None
patent: 9966557 (1999-12-01), None
International Search Report for PCT/JP2008/053612 mailed May 20, 2008.

Affiliated with

Also associated with

Rating

Semiconductor chip and semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip and semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip and semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2655390