Semiconductor chip and package with heat dissipation

Details Semiconductor chip and package with heat dissipation Semiconductor chip and package with heat dissipation

1998-06-05

2000-04-25

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257693, 257685, 257688, 257778, 257690, 257734, 257737, 257738, 361729, 361730, 361735, 361761, 361783, 361790, H01L 2352

Patent

active

060547596

ABSTRACT:
A semiconductor chip is die-bonded on a tape. A plurality of electrodes for power supply for supplying power are formed at an upper surface of the semiconductor chip, and a plurality of electrodes for signal communication for communicating signals are formed at a lower surface of the semiconductor chip. The semiconductor chip, the tape and the like are sealed within a package. A power supply wiring formed external to the package is connected to an electrode for power supply. Thus, a semiconductor device is obtained which efficiently releases the heat generated at the semiconductor chip and contemplates increasing the number of electrodes for signal communication.

REFERENCES:
patent: 5239198 (1993-08-01), Lin et al.
patent: 5808357 (1998-09-01), Sakoda et al.

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