Semiconductor chip and method of manufacturing the same

Details Semiconductor chip and method of manufacturing the same Semiconductor chip and method of manufacturing the same

1998-05-07

2000-05-09

Dutton, Brian

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257922, H01L 2358, H01L 2302

Patent

active

060607734

ABSTRACT:
A semiconductor chip has a nonvolatile memory formed on the upper surface side of a semiconductor substrate. The chip includes at least one recess portion formed in the lower surface of the semiconductor substrate. The recess portion is located in a region corresponding to the nonvolatile memory. A method of manufacturing the semiconductor chip is also disclosed.

REFERENCES:
patent: 4328414 (1982-05-01), Atalla
patent: 4453074 (1984-06-01), Weistein
patent: 5131091 (1992-07-01), Mizuta
patent: 5450366 (1995-09-01), Watanabe
patent: 5510655 (1996-04-01), Tanielian
patent: 5608718 (1997-03-01), Schiewe

Affiliated with

Also associated with

Rating

Semiconductor chip and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1067765