Semiconductor chip and method of fabricating the same

Details Semiconductor chip and method of fabricating the same Semiconductor chip and method of fabricating the same

2006-02-03

2009-12-29

Jackson, Jr., Jerome (Department: 2815)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Using structure alterable to nonconductive state

C438S467000, C438S601000, C257S529000, C257SE21314, C257SE21232

Reexamination Certificate

active

07638369

ABSTRACT:
There is provided a semiconductor chip having fuses. The semiconductor chip includes fuses each having a first terminal electrically connected to a first logic circuit, a second terminal electrically connected to a second logic circuit, and a blowable region formed between the first terminal and the second terminal; and fuse residues each having the same patterns with those of the first terminal and the second terminal of the fuses, and configured so that patterns corresponded to the first terminals and the second terminals are electrically disconnected from each other.

REFERENCES:
patent: 7312109 (2007-12-01), Madurawe
patent: 2004/0018711 (2004-01-01), Madurawe
patent: 2005/0181546 (2005-08-01), Madurawe
patent: WO 98/09327 (1998-03-01), None
K. Arndt et al., Reliability of Laser Activated Metal Fuses in DRAMs, 1999 IEEE/CPMT Int'l Electronics Manufacturing Technology Symposium, p. 389-394.

Affiliated with

Also associated with

Rating

Semiconductor chip and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip and method of fabricating the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4134359