Semiconductor chip and method for manufacturing same,...

Details Semiconductor chip and method for manufacturing same,... Semiconductor chip and method for manufacturing same,...

2011-06-07

2011-06-07

Quach, Tuan N. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257SE21509, C257SE23021, C438S613000, C438S614000

Reexamination Certificate

active

07956460

ABSTRACT:
A semiconductor chip according to the present invention includes a semiconductor substrate, a bump of a metal projecting from a surface of the semiconductor substrate, and an alloy film covering the entire surface of the bump, the alloy film being composed of an alloy of the metal of the bump and a second metal.

REFERENCES:
patent: 5449955 (1995-09-01), Debiec et al.
patent: 6337245 (2002-01-01), Choi
patent: 6350677 (2002-02-01), Ko et al.
patent: 6433429 (2002-08-01), Stamper
patent: 6458609 (2002-10-01), Hikita et al.
patent: 7067423 (2006-06-01), Ohara
patent: 2002/0037643 (2002-03-01), Ishimaru
patent: 2002/0149117 (2002-10-01), Shibata
patent: 2003/0207499 (2003-11-01), DiStefano et al.
patent: 1286497 (2001-03-01), None
patent: 04-065832 (1992-03-01), None
patent: 4-266037 (1992-09-01), None
patent: 05-062979 (1993-03-01), None
patent: 8-88307 (1996-04-01), None
patent: 2000-188305 (2000-07-01), None
patent: 2000-306949 (2000-11-01), None
patent: 2000-340595 (2000-12-01), None
patent: 2003-201574 (2003-07-01), None
patent: 2003-297868 (2003-10-01), None

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