Semiconductor chip and electronic module with integrated surface

Details Semiconductor chip and electronic module with integrated surface Semiconductor chip and electronic module with integrated surface

1994-10-17

1996-05-28

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257777, 257528, 257532, 257536, H01L 23528, H01L 23538

Patent

active

055214347

ABSTRACT:
A fabrication method and resultant electronic module having one or more surfaces enhanced with interconnects and components. Electronic modules having, for example, resistors and capacitors integral with a side surface thereof are disclosed. Further described are electronic modules with interconnects electrically attaching for example, side to side, or side to end surfaces are described. Moreover, discussion of an electronic module having a Silicon Front Face chip is contained herein. Specific details of the fabrication method, resulting electronic module, and related wafer processing are set forth.

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patent: 5382827 (1995-01-01), Wang et al.

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